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BySprint Pro Unique high speed laser cutting system

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Customer benefit

  • The shortest part times thanks to the efficient combination of highspeed plasma cutting with high machine dynamics.
  • 15 – 40 % shorter cutting times with the help of the 3.75-inch cutting head optimized for thin-sheet applications.
  • Minimal operating costs due to power-saving and abrasion-free semiconductor power supply and magnet-mounted compressors.
  • Great process stability thanks to the latest Bystronic technologies.
Laser sources (power) 4400 W
Cutting range 3048 x 1524 mm
Maximum axis acceleration 12 m/s2
Maximum positioning speed parallel to the axis 100 m/min
Maximum positioning speed simultaneous 140 m/min
Machine size 3015
Source: Bystronic

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